Aluminum EMI / RF Shield

ABSTRACT

A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing shielding materials. The shield for circuitry on a circuit board comprising an aluminum material plated with a solderable material, the shield providing electromagnetic interference and radio frequency interference shielding and heat transfer when positioned over a circuit.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of, and claims the benefit ofpriority to, U.S. patent application Ser. No. 14/210,561 filed on Mar.14, 2014, now U.S. Pat. No. 9,538,693, which claims priority to U.S.Provisional Patent Application No. 61/788,151 filed on Mar. 15, 2013,the entire disclosures of which is expressly incorporated herein byreference.

BACKGROUND

Field

The present disclosure relates to an EMI/RF shield for circuitry on acircuit board and more particularly an EMI/RF shield comprised ofaluminum or an aluminum-based alloy and plated with a solderablematerial.

Related Art

Traditional EMI/RF shielding materials include but are not limited tonickel silver, tin plated cold rolled steel or SPTE, stainless steel,brass, or phosphor bronze materials which are good for formability andEMI/RF shielding but are poor from a thermal performance perspective orcost prohibitive for a shielding application.

One piece shields are typically used on thin devices where the height isa concern and replaceable lids cannot be used due to heightrestrictions. One piece shields are also used for cost saving solutionswhen compared to two piece shields. Two piece shielding solutions aregenerally used for reworkability and testing, and are typically highercost.

SUMMARY

A shield made from aluminum (AL) or an aluminum-based alloy coated witha solderable plating such as nickel or tin provides thermal improvementover existing shielding materials. Plated aluminum offers enhancedthermal performance while also offering a significant weight reductionwhen compared to commonly used shielding materials. Aluminum in its rawform is not a solderable material but can be pre-processed and/orpost-processed with a solderable plating allowing the shield to besoldered directly to a circuit board. The aluminum-based shield helpsspread heat generated from a device (IC) across the top surface of theEMI lid flattening out “hot spots.” Due to the higher thermalconductivity of aluminum and the ability to solder the shield directlyto the board, the shield will also transfer heat from the top surfacedown the shield side walls and “dump” the heat into the circuit board.Circuit boards constructed using layers of copper traces will transferheat away from the device offering a lower operating temperatureimproving device life and reliability.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing features will be apparent from the following DetailedDescription, taken in connection with the accompanying drawings, inwhich:

FIG. 1 is a side view of a two-piece EMI/RF shield consisting of a fenceand lid;

FIG. 2 is a perspective view showing two two-piece EMI/RF shields eachwith a lid attached to a fence around circuitry on a board;

FIG. 3 is a perspective view showing a one piece reworkable shield thatcan be attached directly to a circuit board;

FIG. 4 is a side view of another EMI/RF shield with heat dissipatingfins attached to the shield;

FIG. 5 is a perspective view of the shield shown in FIG. 4;

FIG. 6 is a perspective view of an EMI/RF shield with heat fins thereon;and

FIG. 7 is a perspective view of a EMI/RF shield with heat fins thereon.

DETAILED DESCRIPTION

An EMI/RF shield is made of aluminum or an aluminum-based alloy to takeadvantage of the thermal performance of aluminum. To allow forsoldering, the aluminum material is plated with a solderable materialsuch as nickel or tin.

FIG. 1 is a side view of a heat shield made of aluminum or analuminum-based alloy, generally indicated at 10. The shield lid 10 isattached to a fence 9 which is attached to a circuit board and surroundscircuitry. Other ways of attachment of the shield 10 to a circuit boardcircuitry are considered to be written within the scope of thisdisclosure. The shield 10 includes an upper surface 20 and may includeone or more side walls 30, forming a lid that can be positioned over acircuit to provide for electromagnetic interference and radio frequencyshielding. For example, the shield could have four walls and a top wallto form a five-sided lid. A benefit of using aluminum or analuminum-based alloy is the enhanced thermal performance and weightreduction as compared to other shielding materials. Because of thethermal conductivity of the aluminum, the shield transfers heat from thetop surface down the side walls of the shield and can dump the heat intothe circuit board where it is dissipated.

FIG. 2 is a perspective view showing two fences 9 on a circuit board 8with shields lids 10 attached to the fences 9. All of the shieldsdiscussed herein could be one or two piece shields that could beattached to circuit boards by attachment to fences or in other waysknown in the art. The shield can be attached to the fencing in any wayknown in the art, such as by soldering. The attachment can be snap downor as otherwise know in the art. The shields 10 include top wall 20 andside walls 30. The shields lids 10 are made of an aluminum oraluminum-based alloy plated with a solderable material such as nickel ortin. The fence 9 can be made of aluminum or an aluminum-based alloyplated with a solderable material such as nickel or tin to permitsoldering of the shield. The aluminum containing shields disclosedherein can be manufactured in accordance with what is known in the artin connection with manufacturing shields of conventional shieldingmaterials. The aluminum material can be plated with nickel, tin oranother solderable material before or after being formed into a lidconfiguration.

FIG. 3 is a perspective view showing a one piece reworkable shield 10Athat could be made of aluminum or an aluminum-based alloy that can beattached directly to a circuit board. The shield 10A includes top wall20A and side walls 30A. The shield 10A is made of aluminum or analuminum-based alloy plated with a solderable material such as nickel ortin to permit soldering of the shield directly to the circuit board. Thefence 9 are made of aluminum or an aluminum-based alloy plated with asolderable material such as nickel or tin to permit soldering of theshield. The aluminum containing shields disclosed herein can bemanufactured in accordance with what is known in the art in connectionwith manufacturing shields of conventional shielding materials. Thealuminum material can be plated with nickel, tin or another solderablematerial before or after being formed into a configuration with sidewalls. The shield could be peelable or non-peel. If it is a peel shieldand if it is re-worked and the lid is removed, the fence is left behindattached to the board requiring a replacement lid that snaps on theexisting fence.

FIG. 4 shows a shield generally indicated at 110 attached to a fence 9.The shield has a top wall 120 and may have one or more side walls 130.The shield includes heat dissipating fins generally indicated at 140attached to the top wall. The fins 140 can be soldered to the top wall120 of the shield 110. The fins can be made of the same material as theshield, e.g. aluminum or an aluminum-based alloy that can be plated withnickel, tin or other solderable material. Of course the fins can be madeof an entirely different material than the shield, such as aconventional non-aluminum material, if desired. The fins can be shapedas desired in accordance with what is known in the art. The fins couldbe plated with a solderable material before or after the fins are shapedinto final form. As shown in FIG. 4, fins 140 can have a series ofvalleys 142 for contact to and solderable connection with the top wall120 of shield 110. The fins 140 can have a plurality of upstanding walls144 and tops 146 connected between upstanding walls. Upstanding walls144 can have further heat dissipating features such as further fins 148to provide greater surface area for increased heat dissipation.

FIG. 5 is a perspective view of the shield with fins shown in FIG. 4. Asdiscussed with respect to FIG. 3, the shield 110 includes a top 120 andmay include side walls 130. The shield 110 is attached to fence 9 on acircuit board. Fins 140 include a series of valleys 142 wherein the fins140 can be soldered to the top wall 120, a plurality of upstanding walls144 and a plurality of top surfaces 146 which interconnect adjacentupstanding walls 144. Further, upstanding walls 144 may include furtherheat dissipation features such as additional fins 148.

FIG. 6 is a perspective view of another aluminum or aluminum-basedshield with fins. The shields 210 includes a top wall 220 and mayinclude side walls 230. The shields 210 are attached to fences 9 on acircuit board 8. Fins 240 include a series of valleys 242 that can besoldered to the top wall 220, a plurality of upstanding walls 244 and aplurality of top surfaces 246 which interconnect adjacent upstandingwalls 244. As shown, the upstanding walls 244 can be configured toextend at right angles with respect to the top wall 220.

FIG. 7 is a perspective view of another aluminum or aluminum-basedshield with fins. The shield 310 includes a top wall 320 and may includeside walls 330. The shield 310 is attached to fence 9 on a circuitboard. Fins 340 include a series of valleys 342 wherein the fins 340 canbe soldered to the top wall 320, a plurality of upstanding walls 344 anda plurality of top surfaces 346 which interconnect adjacent upstandingwalls 344. As shown, the upstanding walls 344 of fins 340 can beconfigured to extend from the top wall at an angle other than a rightangle from the top wall 320. Further, upstanding walls 344 may includefurther heat dissipation features such as additional fins 348.

The shields disclosed herein can be: single piece shields that arenon-peelable or non-reworkable; single piece shields that arepeelable/reworkable; two piece shields including a fence and lid bothmade using plated aluminum; two piece shields including a fence and lid,one component of which is plated aluminum (typically the lid) (the fencecould use nickel silver, cold rolled steel or plated stainless steel);and two piece shields with soldered pre- or post-plated aluminum orcopper (not limited to material selection) fin stock soldered to platedlid surface.

Low profile/low power devices such as mobile handsets, tablets, thinlaptops may use either a one or two piece shield solution withoutsoldered fin stock to the lid offering a thermal advantage over commonlyused nickel silver and cold rolled shields.

High power applications such as RF modules, processor modules whichtypically are found in larger case structures (e.g. server chassis,wireless modems, set top boxes or cable boxes) which are typically forceconvection cooled. These devices can use plated fin stock to offeradditional thermal improvement when used with the base plated aluminumfence and lid. Fin stock (formed, folded, stamped, etc.) is soldered tothe top surface of the EMI/RF shield lid increasing thermal performance.

Having thus described the disclosure in detail, it is to be understoodthat the foregoing description is not intended to limit the spirit orscope thereof. It will be understood that the embodiments of the presentdisclosure described herein are merely exemplary and that a personskilled in the art may make any variations and modification withoutdeparting from the spirit and scope of the disclosure. All suchvariations and modifications, including those discussed above, areintended to be included within the scope of the disclosure. What isdesired to be protected is set forth in the following claims.

What is claimed is:
 1. A shield attached to a circuit board forproviding electromagnetic interference and radio frequency interferenceshielding and heat transfer when positioned over a circuit, the shieldcomprising: aluminum plated with a solderable material.
 2. The shield ofclaim 1, wherein the aluminum comprises an aluminum based alloy.
 3. Theshield of claim 1, wherein the solderable material comprises at leastone of nickel or tin.
 4. The shield of claim 1, wherein the shieldcomprises a top wall and one or more side walls.
 5. The shield of claim4, further comprising heat dissipating fins attached to the top wall ofthe shield.
 6. The shield of claim 1, wherein the shield is a one pieceshield.
 7. The shield of claim 1, wherein the shield is a two pieceshield comprising a fence and a lid attached to the fence.
 8. The shieldof claim 1, wherein the shield is peelable.
 9. The shield of claim 1,wherein the shield is non-peelable.
 10. A circuit shield assemblycomprising: a circuit board including circuitry thereon; a shieldcontaining aluminum plated with a solderable material, the shieldattached to the circuit board enclosing at least a portion of thecircuitry, the shield transferring heat generated by the circuitry froma top surface of the shield to the circuit board, the shield providingelectromagnetic interference and radio frequency interference shielding.11. The shield of claim 10, wherein the aluminum comprises an aluminumbased alloy.
 12. The shield of claim 10, wherein the solderable materialcomprises at least one of nickel or tin.
 13. The shield of claim 10,wherein the shield comprises a top wall and one or more side walls. 14.The shield of claim 13, wherein the shield further comprises heatdissipating fins attached to the top wall.
 15. The shield assembly ofclaim 13, wherein heat is transferred from the top wall of the shielddown side walls of the shield.
 16. The shield of claim 10, wherein theshield is a one piece shield.
 17. The shield of claim 10, wherein theshield is a two piece shield comprising a fence and a lid attached tothe fence.
 18. The shield assembly of claim 17, wherein the fence isattached the circuit board and surrounds at least a portion of thecircuitry.
 19. The shield of claim 10, wherein the shield is peelable.20. The shield of claim 10, wherein the shield is non-peelable.